I once read on somewhere on these forums (or perhaps by email) that the EMX 8 layer pcb was difficult to design. Does anyknow know the answers to the following questions anout the EMX?
- What was the reason for an 8 layer design? Complexity, Cost, Size or Other. I’ve always figured it was size.
- What kind of PCB Lamination was used? Standard, Hybryd or Fusion (I assumed it was not Hybryd)
- How is are the blind VIAs plated? Is it the same as the through hole ones?